IP Library › Granted Patent US 6,663,674
Granted Patent Utility
US 6,663,674 · Confirmation No. 4207

METHOD OF HANDLING A SILICON WAFER

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2003-10-20 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-04-19 TRNA Transmittal of New Application 2 View
2002-04-19 SPEC Specification 14 View
2002-04-19 CLM Claims 3 View
2002-04-19 ABST Abstract 1 View
2002-04-19 DRW Drawings-only black and white line drawings 1 View
2002-04-19 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,663,674
App. No.
10/126,372
Filed
2002-04-19
Granted
2003-12-16
Pub. No.
US20020173154A1
Art Unit
2812
PTA
-3 days