Patent Assignment
Reel/Frame 014607/0234
Assignment of Assignor's Interest
Recorded: 2003-10-21
Pages: 7
Assignors
TUCKER, MICHAEL THOMAS
Executed: 2002-05-09
BREEDEN, TERRY
Executed: 2002-04-25
OTTOW, STEFAN
Executed: 2002-04-19
KOSTLER, WOLFRAM
Executed: 2002-05-03
WISSEL, DAN
Executed: 2002-05-05
Assignees
INFINEON TECHNOLOGIES SC300 GMBH & CO. KG
KONIGSBRUCKER STRASSE 180, DRESDEN, 01099, GERMANY
INFINEON TECHNOLOGIES AG
ST.-MARTIN-STRASSE 53, PATENTABTEILUNG, MUNCHEN, 81669, GERMANY
MOTOROLA INC.
1303 ALGONQUIN ROAD, SCHAMBURG, ILLINOIS, 60196
Covered Property
(1)
Method of Handling a Silicon Wafer
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 7, 2004
From: MOTOROLA, INC.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 015698/0657 →
Security Agreement
Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
Assignment of Assignor's Interest
Jan 14, 2010
From: INFINEON TECHNOLOGIES AG; INFINEON TECHNOLOGIES SC300 GMBH & CO. KG
To: QIMONDA AG
Reel/Frame 023791/0388 →
Assignment of Assignor's Interest
May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
Merger
Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040652 Frame: 0241. Assignor(S) Hereby Confirms the Merger and Change of Name.
Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →