Assignment of Assignor's Interest

Recorded: 2010-01-18 Pages: 4

Assignors

PARK, SANG-JUN

Executed: 2010-01-11

HAN, CHANG-HEE

Executed: 2010-01-11

LEE, HO-YOUNG

Executed: 2010-01-11

JEONG, SEONG-HOE

Executed: 2010-01-11

Assignee

IPS LTD.

33, JIJE-DONG, PYUNGTAEK-SI, KYUNGKI-DO, 450-090, KOREA, REPUBLIC OF

Covered Property (1)

Apparatus, Method for Depositing Thin Film on Wafer and Method for Gap-Filling Trench Using the Same

Application: 12/669,498 →

Publication: US 2010/0190341

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.