Assignment of Assignor's Interest

Recorded: 2010-01-08 Pages: 4

Assignor

YAMASHITA, TAKANORI

Executed: 2009-12-15

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Semiconductor device which exposes die pad without covered by interposer and its manufacturing method

Application: 12/654,928 →

Publication: US 2010/0181658

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.