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App. No. 12/654,928 · Confirmation No. 2399

Semiconductor device which exposes die pad without covered by interposer and its manufacturing method

Inventor: Takanori Yamashita
Expressly Abandoned -- During Examination View Publication ↗
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2011-08-06 PGEA.G Petition for PreGrant Publication Express Abandonment - Granted 1 View
2011-08-01 PGEA Request for Express Abandonment for refund or to avoid publication 1 View
2010-07-22 NTC.PUB Notice of Publication 1 View
2010-05-06 PD.FILED.E Priority Documents electronically retrieved by USPTO from a participating IP Office 25 View
2010-04-13 APP.FILE.REC Filing Receipt 3 View
2010-01-08 TRNA Transmittal of New Application 8 View
2010-01-08 SPEC Specification 18 View
2010-01-08 CLM Claims 4 View
2010-01-08 ABST Abstract 1 View
2010-01-08 DRW Drawings-only black and white line drawings 9 View
2010-01-08 OATH Oath or Declaration filed 2 View
2010-01-08 TRAN.LET Transmittal Letter 1 View
2010-01-08 IDS Information Disclosure Statement (IDS) Form (SB08) 1 View
2010-01-08 FOR Foreign Reference 9 View
2010-01-08 FOR Foreign Reference 18 View
2010-01-08 WFEE Fee Worksheet (SB06) 1 View
2010-01-08 WFEE Fee Worksheet (SB06) 1 View
2010-01-08 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
12/654,928
Filed
2010-01-08
Pub. No.
US20100181658A1
Art Unit
2893