Patent Assignment
Reel/Frame 023838/0794
Assignment of Assignor's Interest
Recorded: 2010-01-25
Pages: 2
Assignor
HABE, MITSUNOBU
Executed: 2007-02-13
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Package Capable of Potting Thermosetting Resin While Being Heated
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.