IP Library › Assignment 024004/0375
Patent Assignment
Reel/Frame 024004/0375

Assignment of Assignor's Interest

Recorded: 2010-02-16 Pages: 4
Assignors
INOUE, NAOYA
Executed: 2010-02-05
HAYASHI, YOSHIHIRO
Executed: 2010-02-05
KANEKO, KISHOU
Executed: 2010-02-05
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Device and Method of Manufacturing Semiconductor Device Including Wiring via and Switch via for Connecting First and Second Wirings
Patent: 8,390,124 →
Application: 12/656,728 →
Publication: US 2010/0207093
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025193/0001 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →