IP Library › Assignment 024015/0132
Patent Assignment
Reel/Frame 024015/0132

Assignment of Assignor's Interest

Recorded: 2010-03-02 Pages: 2
Assignor
WANG, CHUNG YU
Executed: 2010-03-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Thermally-Enhanced Hybrid Led Package Components
Patent: 8,183,580 →
Application: 12/715,872 →
Publication: US 2011/0215361
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 12, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027842/0358 →
Merger Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0600 →
Change of Name Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0983 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →