IP Library › Assignment 027842/0358
Patent Assignment
Reel/Frame 027842/0358

Assignment of Assignor's Interest

Recorded: 2012-03-12 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Thermally-Enhanced Hybrid Led Package Components
Patent: 8,183,580 →
Application: 12/715,872 →
Publication: US 2011/0215361
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 2, 2010
From: WANG, CHUNG YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 024015/0132 →
Merger Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0600 →
Change of Name Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0983 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →