Patent Assignment
Reel/Frame 024027/0737
Assignment of Assignor's Interest
Recorded: 2010-03-04
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Multi-Chip Package Structure Suitable for Multi-Processor System Having Memory Link Architecture
Application:
12/717,027 →
Publication:
US 2011/0013353