Patent Assignment
Reel/Frame 024030/0914
Assignment of Assignor's Interest
Recorded: 2010-03-04
Pages: 3
Assignee
POWERTECH TECHNOLOGY INC.
NO. 26, DATONG RD., HSINCHU INDUSTRIAL PARK, HUKOU SHIANG, HSINCHU, TAIWAN
Covered Property
(1)
Flip Chip Package Maintaining Alignment During Soldering