IP Library › Assignment 024066/0841
Patent Assignment
Reel/Frame 024066/0841

Assignment of Assignor's Interest

Recorded: 2010-03-13 Pages: 4
Assignor
SIPIX IMAGING, INC.
Executed: 2010-02-09
Assignee
SIPIX CHEMICAL INC.
NO.22, BEIYUAN RD., ZHONGLI CITY, TAOYUAN COUNTY, 320, TAIWAN
Covered Properties (5)
Process for Forming a Patterned Thin Film Structure for in-Mold Decoration
Patent: 7,156,945 →
Application: 10/665,992 →
Publication: US 2004/0112237
Process for Forming a Patterned Thin Film Structure for in-Mold Decoration
Patent: 7,972,472 →
Application: 11/612,364 →
Publication: US 2007/0160762
Durable Layer Composition for in-Mold Decoration
Patent: 7,927,711 →
Application: 11/743,007 →
Publication: US 2007/0267130
Release Layer for in-Mold Decoration
Patent: 7,910,205 →
Application: 12/039,554 →
Publication: US 2008/0152855
Adhesive Layer Composition for in-Mold Decoration
Patent: 8,192,837 →
Application: 12/337,478 →
Publication: US 2009/0098362
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 21, 2004
From: CHAUG, YI-SHUNG; WANG, XIAOJIA; KILUK, SEAN; TSENG, SCOTT
To: SIPIX IMAGING, INC.
Reel/Frame 014276/0261 →
Assignment of Assignor's Interest Jan 20, 2011
From: SIPIX CHEMICAL INC.
To: SIPIX IMAGING, INC.; ETANSI INC.
Reel/Frame 025671/0415 →
Change of Name May 26, 2011
From: SIPIX CHEMICAL INC.
To: ETANSI INC.
Reel/Frame 026357/0077 →