Release layer for in-mold decoration

1. An in-mold decoration tape comprising a carrier layer, a release layer, a durable layer, a decorative design layer and an adhesive layer, wherein said carrier layer, said release layer, said durable layer, said decorative design layer and said adhesive layer are sequentially stacked on one another and said release layer comprises a copolymer or interpenetration network formed from a composition comprising:

(i) an amine-aldehyde condensate; and

(ii) a radical inhibitor or quencher selected from the group consisting of phenol, methoxyphenol, cresol, phenol formaldehyde resins, novolacs, resoles, resorcinol, salicylates, hydroxyl salicylates, trihydroxybenzene, oximes, hindered amine oxides, nitrosobenzenes and oxidized derivatives or metal complexes of oximes, hindered amine oxides or nitrosobenzenes.

2. The in-mold decoration tape of claim 1 , wherein said amine-aldehyde condensate is a formaldehyde condensate of a multifunctional amine.

3. The in-mold decoration tape of claim 2 , wherein said multifunctional amine is melamine or urea.

4. The in-mold decoration tape of claim 2 , wherein said release layer comprises from about 40% to about 95% by weight of said amine-formaldehyde condensate.

5. The in-mold decoration tape of claim 1 , wherein said radical inhibitor or quencher is a polyphenol.

6. The in-mold decoration tape of claim 1 , wherein said hindered amine oxide is 2,2,6,6-tetramethyl-1-piperidinyloxy, 4-hydroxy-2,2,6,6-tetramethyl-1-piperidinyloxy or 4-oxo-2,2,6,6-tetramethyl-1-piperidinyloxy.

7. The in-mold decoration tape of claim 1 , wherein said release layer comprises about 1% to about 60% by weight of said radical inhibitor or quencher.

8. The in-mold decoration tape of claim 1 , wherein said composition further comprises a catalyst.

9. The in-mold decoration tape of claim 8 , wherein said catalyst is sulfuric acid, toluene sulfonic acid, dodecylsulfonic acid, dodecylbenzenesulfonic acid, hydrochloric acid, phosphoric acid, HBF.sub.4, HPF.sub.6, HSbF.sub.6, HAsF.sub.6 or a salt thereof with a fugitive base.

10. The in-mold decoration tape of claim 1 , wherein said composition further comprises a crosslinking agent.

11. The in-mold decoration tape of claim 10 , wherein said crosslinking agent is selected from the group consisting of formaldehyde, glyoxal, succinaldehyde, hexamethylene tetramine, phenolics, malonate blocked isocyanates, polyols, carbamate functionalized polymers, amine functionalized polymers and amide functionalized polymers.

12. The in-mold decoration tape of claim 1 , wherein said composition further comprises a UV absorbing moiety.

13. The in-mold decoration tape of claim 12 , wherein said UV absorbing moiety is o-hydroxy benzophenone, 2,2′-dihydroxy-4-methoxybenzophenone, o-hydroxyphenyl-triazine, salicylates, .alpha.-cyano-.beta.-phenyl-cinnamates, hydroxyphenyl benzotriazole or benzoxazinone.

14. The in-mold decoration tape of claim 1 , wherein said composition further comprises a silicone resin.

15. The in-mold decoration tape of claim 14 , wherein said silicone resin is a silicone block or graft copolymer or a silicone polymer having at least one reactive functional group.

16. The in-mold decoration tape of claim 1 , wherein said composition further comprises an additive.

17. The in-mold decoration tape of claim 1 , wherein said composition is dispersed or dissolved in a solvent.

18. The in-mold decoration tape of 17 , wherein said solvent is selected from the group consisting of ketones, esters, ethers, glycol ethers, glycolether esters, and pyrrolidones.

19. The in-mold decoration tape of claim 1 , wherein said release layer is formed by

dispersing or dissolving said composition and a solvent and

curing said composition.

20. The in-mold decoration tape of claim 19 , wherein the radical inhibitor or quencher is oxidized by a thermal or photo-oxidation to improve the UV screening efficiency of the release layer.