IP Library › Assignment 024082/0955
Patent Assignment
Reel/Frame 024082/0955

Assignment of Assignor's Interest

Recorded: 2010-03-15 Pages: 3
Assignors
GOH, KIM-YONG
Executed: 2010-01-28
LUAN, JING-EN
Executed: 2010-01-28
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property (1)
Flip-Chip Fan-Out Wafer Level Package for Package-on-Package Applications, and Method of Manufacture
Patent: 8,884,422 →
Application: 12/651,365 →
Publication: US 2011/0156250
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 25, 2011
From: GOH, KIM-YONG; LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027119/0143 →
Assignment of Assignor's Interest Oct 25, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027119/0146 →
Assignment of Assignor's Interest Oct 13, 2021
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 057777/0820 →
Assignment of Assignor's Interest Oct 25, 2021
From: STMICROELECTRONICS INTERNATIONAL N.V.
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 058298/0235 →