IP Library › Assignment 027119/0146
Patent Assignment
Reel/Frame 027119/0146

Assignment of Assignor's Interest

Recorded: 2011-10-25 Pages: 3
Assignor
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Flip-Chip Fan-Out Wafer Level Package for Package-on-Package Applications, and Method of Manufacture
Patent: 8,884,422 →
Application: 12/651,365 →
Publication: US 2011/0156250
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 15, 2010
From: GOH, KIM-YONG; LUAN, JING-EN
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 024082/0955 →
Assignment of Assignor's Interest Oct 25, 2011
From: GOH, KIM-YONG; LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027119/0143 →
Assignment of Assignor's Interest Oct 13, 2021
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 057777/0820 →
Assignment of Assignor's Interest Oct 25, 2021
From: STMICROELECTRONICS INTERNATIONAL N.V.
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 058298/0235 →