Patent Assignment
Reel/Frame 024166/0328
Assignment of Assignor's Interest
Recorded: 2010-03-31
Pages: 3
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Package and Multichip Arrangement Having a Polymer Layer and an Encapsulant