Assignment of Assignor's Interest

Recorded: 2010-04-09 Received: 2010-04-09 Pages: 7

Assignor

Executed: 2010-03-29

Assignee

KMG ELECTRONIC CHEMICALS, INC.

9555 W. SAM HOUSTON PARKWAY S., SUITE 600, HOUSTON, TX, 77099, UNITED STATES

Covered Properties (8)

Filterable Surfactant Composition

Application: 11/420,742 →

High Temperature and Chemical Resistant Process for Wafer Thinning and Backside Processing

Application: 10/908,230 →

Etchants Containing Filterable Surfactant

Application: 10/984,649 →

Adhesive Support Method for Wafer Coating, Thinning and Backside Processing

Application: 10/899,910 →

Stripper for Cured Negative-Tone Isoprene-Based Photoresist and Bisbenzocyclobutene Coatings

Application: 10/745,079 →

Spin-On Adhesive for Temporary Wafer Coating and Mounting to Support Wafer Thinning and Backside Processing

Application: 10/325,389 →

Cured Polymers Dissolving Compositions

Application: 10/061,556 →

Stable Metal-Safe Stripper for Removing Cured Negative-Tone Novolak and Acrylic Photoresists and Post-Etch Residue

Application: 09/974,704 →