Patent Assignment
Reel/Frame 024246/0632
Assignment of Assignor's Interest
Recorded: 2010-04-16
Pages: 2
Assignors
LIN, CHIH-WEI
Executed: 2010-04-14
CHENG, MING-DA
Executed: 2010-04-14
LU, WEN-HSIUNG
Executed: 2010-04-14
LIU, CHUNG-SHI
Executed: 2010-04-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Fabricating Bump Structure Without Ubm Undercut