Patent Assignment
Reel/Frame 024278/0649
Change of Name
Recorded: 2010-04-23
Pages: 20
Assignor
AMP (JAPAN) LTD.
Executed: 2000-02-01
Assignee
TYCO ELECTRONICS JAPAN G.K.
5-8, HISAMOTO 3-CHOME, TAKATSU-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Semiconductor Component Mounting Apparatus