Patent Assignment
Reel/Frame 024323/0312
Assignment of Assignor's Interest
Recorded: 2010-05-03
Pages: 11
Assignors
MEYER, THORSTEN
Executed: 2010-03-29
LEUSCHNER, RAINER
Executed: 2010-03-30
OFNER, GERALD
Executed: 2010-03-29
HESS, REINHARD
Executed: 2010-04-06
SEZI, RECAI
Executed: 2010-03-29
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Packaged Semiconductor Device with Encapsulant Embedding Semiconductor Chip That Includes Contact Pads