IP Library › Assignment 024326/0691
Patent Assignment
Reel/Frame 024326/0691

Assignment of Assignor's Interest

Recorded: 2010-05-03 Pages: 2
Assignor
WANG, CHUNG YU
Executed: 2010-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Vertical Led Chip Package on Tsv Carrier
Patent: 8,900,893 →
Application: 12/704,381 →
Publication: US 2011/0193056
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 13, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027855/0848 →
Merger Dec 8, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037508/0093 →
Change of Name Dec 8, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037508/0131 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →