Patent Assignment
Reel/Frame 037508/0093
Merger
Recorded: 2015-12-08
Pages: 13
Assignor
CHIP STAR LTD.
Executed: 2015-07-15
Assignee
EPISTAR CORPORATION
5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Properties
(12)
Vertical Led Chip Package on Tsv Carrier
Light-Emitting Devices on Textured Substrates
Light-Emitting Diode (Led) Package Systems and Methods of Making the Same
Double Substrate Multi-Junction Light Emitting Diode Array Structure
Systems and Methods Providing Semiconductor Light Emitters
Led Lamp and Method of Making the Same
Wafer Level Photonic Device Die Structure and Method of Making the Same
Method and Apparatus for Accurate Die-to-Wafer Bonding
Thermal Protection Structure for Multi-Junction Led Module
Structure and Method for Led with Phosphor Coating
Led Packaging Structure Having Improved Thermal Dissipation and Mechanical Strength
Doubled Substrate Multi-Junction Light Emitting Diode Array Structure
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 22, 2011
From: TANG, YU-SHENG; CHEN, HSIN-HUNG; KU, HAO-WEI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025996/0938 →
Assignment of Assignor's Interest
Mar 25, 2014
From: WU, YI-TSUO
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 032522/0760 →
Assignment of Assignor's Interest
Feb 20, 2015
From: YU, CHIH-KUANG; CHERN, CHYI SHYUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034990/0303 →
Assignment of Assignor's Interest
Feb 20, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034990/0325 →
Change of Name
Dec 8, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037508/0131 →
Assignment of Assignor's Interest
Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →