Patent Assignment
Reel/Frame 032522/0760
Assignment of Assignor's Interest
Recorded: 2014-03-25
Pages: 3
Assignor
WU, YI-TSUO
Executed: 2012-02-26
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH RD., HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Led Packaging Structure Having Improved Thermal Dissipation and Mechanical Strength
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Dec 8, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037508/0093 →
Change of Name
Dec 8, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037508/0131 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →