Patent Assignment
Reel/Frame 037508/0131
Change of Name
Recorded: 2015-12-08
Pages: 15
Assignor
TSMC SOLID STATE LIGHTING LTD.
Executed: 2015-04-02
Assignee
CHIP STAR LTD.
NO. 9 LIXING 4TH RD., HSINCHU SCIENCE AND INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Properties
(12)
Vertical Led Chip Package on Tsv Carrier
Light-Emitting Devices on Textured Substrates
Light-Emitting Diode (Led) Package Systems and Methods of Making the Same
Double Substrate Multi-Junction Light Emitting Diode Array Structure
Systems and Methods Providing Semiconductor Light Emitters
Led Lamp and Method of Making the Same
Wafer Level Photonic Device Die Structure and Method of Making the Same
Method and Apparatus for Accurate Die-to-Wafer Bonding
Thermal Protection Structure for Multi-Junction Led Module
Structure and Method for Led with Phosphor Coating
Led Packaging Structure Having Improved Thermal Dissipation and Mechanical Strength
Doubled Substrate Multi-Junction Light Emitting Diode Array Structure
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 2014
From: WU, YI-TSUO
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 032522/0760 →
Assignment of Assignor's Interest
Feb 20, 2015
From: YU, CHIH-KUANG; CHERN, CHYI SHYUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034990/0303 →
Assignment of Assignor's Interest
Feb 20, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034990/0325 →
Merger
Dec 8, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037508/0093 →
Assignment of Assignor's Interest
Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →