IP Library Assignment 024378/0396
Patent Assignment
Reel/Frame 024378/0396

Assignment of Assignor's Interest

Recorded: 2010-05-13 Pages: 4
Assignor
GANDHI, DINESH
Executed: 2010-04-29
Assignee
PSION TEKLOGIX INC.
2100 MEADOWVALE BLVD., MISSISSAUGA, L5N 7J9, CANADA
Covered Property (1)
Overmould for Sealing Using Double Overmould
Patent: 9,662,816 →
Application: 12/765,993 →
Publication: US 2011/0259902
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 23, 2012
From: PSION TEKLOGIX INC.
To: PSION INC.
Reel/Frame 028840/0345 →