IP Library Granted Patent US 9,662,816
Granted Patent B2
US 9,662,816 · App. 12/765,993 · Granted May 30, 2017

Overmould for sealing using double overmould

Inventor: Dinesh Nataly Gandhi (Brampton, CA)
Assignee: Psion Inc.
B29C45/1671B29K2021/00
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Quick Facts
Patent No.
US 9,662,816
App. No.
12/765,993
Granted
May 30, 2017
Kind
B2
Abstract

A method of forming respective overmoulds to protect and seal an enclosure apparatus is provided. Respective separate overmoulds for external surfaces of the enclosure and for sealing a cavity or cavities defined by the enclosure may be formed in a single injection moulding tool in a single operation. An enclosure component and enclosure are also disclosed.

Claims (16)

1. An enclosure component of an electronic device, the enclosure component comprising:

a substrate defining an external surface and a coupling surface for assembly to a component;

an external overmould comprising a first elastomeric material overmoulded to the external surface of the substrate; and

a sealing overmould comprising a second elastomeric material overmoulded to the coupling surface of the substrate, the second elastomeric material being a softer material than the first elastomeric material.

2. The enclosure component of claim 1 wherein the external overmould is a wear resistant and/or mechanical shock resistant overmould and wherein the sealing overmould is for coupling to a surface of another component.

3. The enclosure component of claim 1 comprising at least one interior surface at least partially defining a cavity of an enclosure, the cavity having at least one opening to be sealed by at least one other component of a multi-component enclosure.

4. The enclosure component of claim 3 wherein the at least one interior surface defines a cavity having a first opening and a second opening, each opening to be sealed by a respective overmould.

5. The enclosure component of claim 4 wherein the substrate defines a channel, wholly or partially enclosed by said substrate, between a first region about the first opening and a second region about the second opening through which channel the second elastomeric material is injected to form said second overmould.

6. The enclosure component of claim 1 wherein the substrate comprises a polycarbonate plastic material.

7. An enclosure of an electronic device, the enclosure comprising a plurality of enclosure components for assembly to define said enclosure, a first enclosure component of the plurality of enclosure components comprising:

a substrate defining an external surface and a coupling surface for assembly to a second enclosure component of the plurality of enclosure components;

an external overmould comprising a first elastomeric material overmoulded to the external surface of the substrate; and

a sealing overmould comprising a second elastomeric material overmoulded to the coupling surface of the substrate, the sealing overmould creating a seal between the first and the second enclosure components.

8. The enclosure of claim 7 wherein the first elastomeric material and the second elastomeric material have different physical properties.

9. The enclosure of claim 8 wherein a hardness physical property of the first elastomeric material is greater than the hardness physical property of the second elastomeric material.

10. The enclosure of claim 9 wherein the hardness physical property of the first elastomeric material and second elastomeric material respectively measure about 60 Shore A and about 40 Shore A.

Assignments (2)
CHANGE OF NAME Recorded Aug 23, 2012
From: PSION TEKLOGIX INC.
To: PSION INC.
Reel/Frame 028840/0345 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2010
From: GANDHI, DINESH
To: PSION TEKLOGIX INC.
Reel/Frame 024378/0396 →
Continuity (1)
Related Publication 20110259902A1 · Oct 27, 2011