IP Library Assignment 024466/0074
Patent Assignment
Reel/Frame 024466/0074

Assignment of Assignor's Interest

Recorded: 2010-06-01 Pages: 3
Assignor
KUO, BOB
Executed: 2010-06-01
Assignee
AMKOR TECHNOLOGY, INC
1900 S PRICE RD, CHANDLER, ARIZONA, 85248
Covered Property (1)
Conductive Polymer Lid for a Sensor Package and Method Therefor
Patent: 8,354,747 →
Application: 12/791,472 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →