Patent Assignment
Reel/Frame 024470/0086
Assignment of Assignor's Interest
Recorded: 2010-06-02
Pages: 2
Assignors
CHEN, CHIH-HUA
Executed: 2010-05-26
CHEN, CHEN-SHIEN
Executed: 2010-05-26
KUO, CHEN-CHENG
Executed: 2010-05-26
SHEN, WEN-WEI
Executed: 2010-05-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Through Silicon via with Dummy Structure and Method for Forming the Same