IP Library Assignment 024504/0911
Patent Assignment
Reel/Frame 024504/0911

Assignment of Assignor's Interest

Recorded: 2010-06-08 Pages: 2
Assignor
FLOYD, PHILIP D.
Executed: 2005-03-15
Assignee
IDC, LLC
2415 THIRD STREET, SAN FRANCISCO, CALIFORNIA, 94107
Covered Property (1)
Method and System for Sealing a Substrate
Patent: 7,935,555 →
Application: 12/628,024 →
Publication: US 2010/0072595
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 4, 2011
From: IDC, LLC
To: QUALCOMM MEMS TECHNOLOGIES, INC.
Reel/Frame 025939/0968 →
Assignment of Assignor's Interest Aug 31, 2016
From: QUALCOMM MEMS TECHNOLOGIES, INC.
To: SNAPTRACK, INC.
Reel/Frame 039891/0001 →