Assignment of Assignor's Interest

Recorded: 2011-03-04 Pages: 16

Assignor

IDC, LLC

Executed: 2009-09-25

Assignee

QUALCOMM MEMS TECHNOLOGIES, INC.

5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121

Covered Property (1)

Method and System for Sealing a Substrate

Patent: 7,935,555 →

Application: 12/628,024 →

Publication: US 2010/0072595

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.