Assignment of Assignor's Interest

Recorded: 2010-06-17 Received: 2010-06-17 Pages: 25

Assignor

OEG-TEG, LLC

Executed: 2010-03-19

Assignee

OEM GROUP INC.

2120 W. GUADALUPE ROAD, GILBERT, AZ, 85233, UNITED STATES

Covered Properties (14)

Dry Etch Stop Process for Eliminating Electrical Shorting in Mram Device Structures

Application: 11/724,556 →

Plasma Etch Reactor and Method

Application: 11/087,540 →

System and Method for Processing a Wafer Including Stop-on-Alumina Processing

Application: 10/937,660 →

System for, and Method of, Etching a Surface on a Wafer

Application: 10/633,839 →

Reactive Sputtering of Silicon Nitride Films by Rf Supported Dc Magnetron

Application: 10/446,005 →

Magnetron with Controlled Dc Power

Application: 10/371,463 →

Cluster Tool with a Hollow Cathode Array

Application: 10/212,293 →

Plasma Etch Reactor and Method

Application: 10/156,478 →

Permanent Adherence of the Back End of a Wafer to an Electrical Component or Sub-Assembly

Application: 10/051,886 →

Flat Magnetron

Application: 09/949,181 →

Reactor with Heated and Textured Electrodes and Surfaces

Application: 09/888,365 →

Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer

Application: 09/880,584 →

System for, and Method of, Etching a Surface on a Wafer

Application: 09/829,587 →

Dual Degas/Cool Loadlock Cluster Tool

Application: 09/798,048 →