IP Library › Assignment 024608/0193
Patent Assignment
Reel/Frame 024608/0193

Assignment of Assignor's Interest

Recorded: 2010-06-29 Pages: 5
Assignors
LIAO, CHIH-CHIN
Executed: 2010-06-28
YU, CHEEMAN
Executed: 2010-06-29
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Corrugated Die Edge for Stacked Die Semiconductor Package
Patent: 8,502,375 →
Application: 12/825,617 →
Publication: US 2011/0316164
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 17, 2011
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 026294/0632 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0850 →
Assignment of Assignor's Interest Nov 12, 2021
From: SANDISK TECHNOLOGIES LLC
To: WODEN TECHNOLOGIES INC.
Reel/Frame 058871/0928 →