Assignment of Assignor's Interest

Recorded: 2011-05-17 Pages: 6

Assignor

SANDISK CORPORATION

Executed: 2011-04-04

Assignee

SANDISK TECHNOLOGIES INC.

6900 NORTH DALLAS PARKWAY, TWO LEGACY TOWN CENTER, PLANO, TEXAS, 75024

Covered Property (1)

Corrugated Die Edge for Stacked Die Semiconductor Package

Patent: 8,502,375 →

Application: 12/825,617 →

Publication: US 2011/0316164

Related Assignments (3)

Other recorded transfers of the patent in this record — the chain of ownership.