Patent Assignment
Reel/Frame 024625/0075
Assignment of Assignor's Interest
Recorded: 2010-07-01
Pages: 2
Assignor
NAKAMURA, HIDEHIRO
Executed: 2010-04-26
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinder
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address of Assignee
Jul 25, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 030890/0037 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →