Patent Assignment
Reel/Frame 030890/0037
Change of Address of Assignee
Recorded: 2013-07-25
Pages: 2
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-07-25
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO 100-6606, JAPAN
Covered Property
(1)
Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinder
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 1, 2010
From: NAKAMURA, HIDEHIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 024625/0075 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →