IP Library › Assignment 024647/0895
Patent Assignment
Reel/Frame 024647/0895

Assignment of Assignor's Interest

Recorded: 2010-07-07 Pages: 3
Assignors
CHEN, MING-FA
Executed: 2009-11-23
CHIOU, WEN-CHIH
Executed: 2009-11-23
SHUE, SHAU-LIN
Executed: 2009-11-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Wafer Backside Interconnect Structure Connected to Tsvs
Patent: 8,791,549 →
Application: 12/832,019 →
Publication: US 2011/0068466
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2023
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: ADVANCED MANUFACTURING INNOVATIONS INC.
Reel/Frame 064180/0278 →