Patent Assignment
Reel/Frame 024649/0255
Assignment of Assignor's Interest
Recorded: 2010-06-28
Pages: 3
Assignor
SHIBUYA, KOUJIROU
Executed: 2010-03-31
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Printed Wiring Board, Semiconductor Device, and Method for Manufacturing Printed Wiring Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.