Printed wiring board, semiconductor device, and method for manufacturing printed wiring board

1. A printed wiring board comprising:

a plurality of lands arranged in a mounting area allowing therein mounting of an electronic component; and

an wiring respectively connected to a specific land which is at least one of the outermost lands arranged outermostly out of said lands,

a connection portion of said specific land and said wiring connected to said specific land is positioned inside a closed curve which collectively surrounds, by the shortest path, all of said outermost lands formed in said mounting area.

2. The printed wiring board according to claim 1 ,

further comprising a solder resist layer over the surface thereof,

wherein said solder resist layer has openings respectively formed so as to be positioned at said individual lands and to have larger diameter than said individual lands, and

an intersection of said wiring connected to said specific land, and the inner circumference of each opening corresponded to the said specific land, is positioned inside said closed curve.

3. The printed wiring board according to claim 1 , further comprising:

a via connected to a second specific land which is at least one of the outermost lands but other than said specific land; and

a internal wiring positioned lower than said second specific land, and is connected to said via.

4. The printed wiring board according to claim 1 ,

wherein said wiring connected to at least one of said specific land is routed so as to run between said specific land and the adjacent one of said outermost lands, and to extend outward beyond said closed curve.

5. The printed wiring board according to claim 1 ,

wherein said wiring connected to at least one of said specific land is routed so as to originate from said connection portion, to run once in the direction away from said closed curve, to be folded back, to run between said specific land and the adjacent one of said outermost lands, and to extend outward beyond said closed curve.

6. The printed wiring board according to claim 1 ,

wherein said wiring connected to at least one of said specific land is positioned so that the entire portion thereof falls inside said closed curve, and

said printed wiring board further comprises a via connected to said wiring, and a internal wiring positioned lower than said at least one of specific land, and is connected to said via.

7. The printed wiring board according to claim 1 ,

wherein said specific land contains at least an outermost land disposed at a corner, out of said outermost lands.

8. A semiconductor device comprising:

a printed wiring board including:

a plurality of lands arranged in a mounting area allowing therein mounting of an electronic component; and

an wiring respectively connected to a specific land which is at least one of the outermost lands arranged outermostly out of said lands,

a connection portion of said specific land and said wiring connected to said specific land is positioned inside a closed curve which collectively surrounds, by the shortest path, all of said outermost lands formed in said mounting area; and

a semiconductor chip or a semiconductor package as said electronic component connected to said plurality of lands in said mounting area.

9. A method for manufacturing a printed wiring board, comprising:

forming a plurality of lands on a printed wiring board arranged in a mounting area allowing therein mounting of an electronic component, and

forming an wiring respectively connected to a specific land which is at least one of the outermost lands arranged outermostly out of said lands,

wherein said forming an wiring, said wiring is formed so that a connection portion of said specific land and said wiring connected to said specific land is positioned inside a closed curve which collectively surrounds, by the shortest path, all of said outermost lands formed in said mounting area.