Patent Assignment
Reel/Frame 024668/0133
Assignment of Assignor's Interest
Recorded: 2010-07-12
Pages: 2
Assignee
UTAC THAI LIMITED
237 LASALLE ROAD, BANGNA, BANGKOK, 10260, THAILAND
Covered Property
(1)
Leadframe Feature to Minimize Flip-Chip Semiconductor Die Collapse During Flip-Chip Reflow
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2016
From: UTAC THAI LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0937 →
Corrective Assignment to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0937. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UTAC THAI LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039902/0302 →