IP Library › Assignment 024715/0882
Patent Assignment
Reel/Frame 024715/0882

Assignment of Assignor's Interest

Recorded: 2010-07-20 Pages: 4
Assignor
LEIB, JUERGEN
Executed: 2010-07-15
Assignee
SCHOTT AG
HATTENBERGSTRASSE 10, MAINZ, 55122, GERMANY
Covered Property (1)
Method for Packing Semiconductor Components and Product Produced According to the Method
Patent: 8,420,445 →
Application: 12/667,185 →
Publication: US 2010/0283127
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 30, 2010
From: SCHOTT AG
To: SCHOTT ELECTRONIC PACKAGING ASIA PTE. LTD.
Reel/Frame 025074/0655 →
Assignment of Assignor's Interest Oct 1, 2010
From: SCHOTT ELECTRONIC PACKAGING ASIA PTE. LTD.
To: WAFER-LEVEL PACKAGING PORTFOLIO LLC
Reel/Frame 025077/0418 →