IP Library › Assignment 025074/0655
Patent Assignment
Reel/Frame 025074/0655

Assignment of Assignor's Interest

Recorded: 2010-09-30 Pages: 10
Assignor
SCHOTT AG
Executed: 2008-04-14
Assignee
SCHOTT ELECTRONIC PACKAGING ASIA PTE. LTD.
BLOCK 209 WOODLANDS AVE 9, #01-57 / 58 WOODLANDS SPECTRUM II, SINGAPORE, 738959, SINGAPORE
Covered Property (1)
Method for Packing Semiconductor Components and Product Produced According to the Method
Patent: 8,420,445 →
Application: 12/667,185 →
Publication: US 2010/0283127
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 20, 2010
From: LEIB, JUERGEN
To: SCHOTT AG
Reel/Frame 024715/0882 →
Assignment of Assignor's Interest Oct 1, 2010
From: SCHOTT ELECTRONIC PACKAGING ASIA PTE. LTD.
To: WAFER-LEVEL PACKAGING PORTFOLIO LLC
Reel/Frame 025077/0418 →