Patent Assignment
Reel/Frame 024721/0695
Assignment of Assignor's Interest
Recorded: 2010-07-21
Pages: 5
Assignors
KANG, IN SOO
Executed: 2010-06-17
JUNG, GI JO
Executed: 2010-06-17
JEON, BYOUNG YOOL
Executed: 2010-06-17
Assignee
NEPES CORPORATION
654-2, GAK-RI, OCHANG-MYUN, CHEONGWON-GUN, CHUNGCHEONGBUK-DO, 363-883, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Level Semiconductor Package and Fabrication Method Thereof