IP Library › Assignment 024731/0367
Patent Assignment
Reel/Frame 024731/0367

Assignment of Assignor's Interest

Recorded: 2010-07-23 Pages: 4
Assignors
HSIAO, CHING-WEN
Executed: 2010-02-08
CHUANG, YAO-CHUN
Executed: 2010-02-08
CHEN, CHEN-SHIEN
Executed: 2010-02-08
KUO, CHEN-CHENG
Executed: 2010-02-08
HUANG, RU-YING
Executed: 2010-02-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Robust Joint Structure for Flip-Chip Bonding
Patent: 8,847,387 →
Application: 12/842,304 →
Publication: US 2011/0101519
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →