Patent Assignment
Reel/Frame 024791/0698
Assignment of Assignor's Interest
Recorded: 2010-08-04
Pages: 3
Assignors
YU, CHIH-KUANG
Executed: 2010-03-05
LIU, CHUN-KAI
Executed: 2010-03-05
TAIN, RA-MIN
Executed: 2010-03-05
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING ROAD, CHUTUNG, HSINCHU 31040, TAIWAN
Covered Property
(1)
Package Structures for Integrating Thermoelectric Components with Stacking Chips