Patent Assignment
Reel/Frame 024800/0206
Assignment of Assignor's Interest
Recorded: 2010-08-06
Pages: 2
Assignors
HUANG, HUNG-WEN
Executed: 2010-08-02
HSIA, HSING-KUO
Executed: 2010-08-02
CHIU, CHING-HUA
Executed: 2010-08-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Light Emitting Diode Sidewall Passivation
Application:
12/851,696 →
Publication:
US 2012/0032212
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 3, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027982/0086 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Change of Name
Mar 26, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 038263/0076 →