Patent Assignment
Reel/Frame 027982/0086
Assignment of Assignor's Interest
Recorded: 2012-04-03
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Method of Light Emitting Diode Sidewall Passivation
Application:
12/851,696 →
Publication:
US 2012/0032212
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 6, 2010
From: HUANG, HUNG-WEN; HSIA, HSING-KUO; CHIU, CHING-HUA
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 024800/0206 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Change of Name
Mar 26, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 038263/0076 →