Patent Assignment
Reel/Frame 024837/0936
Corrective Assignment to Correct the Names of Assignees Walter Schwarzenbach and Nadia Ben Mohamed on the Cover Sheet Previously Recorded on Reel 023764 Frame 0592. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Recorded: 2010-08-16
Pages: 12
Assignors
KERDILES, SEBASTIEN
Executed: 2009-07-16
MICHEL, WILLY
Executed: 2009-07-26
SCHWARZENBACH, WALTER
Executed: 2009-07-07
DELPRAT, DANIEL
Executed: 2009-09-02
BEN MOHAMED, NADIA
Executed: 2009-07-29
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
PARC TECHNOLOGIQUE DES FONTAINES, CHEMIN DES FRANQUES, 38190 BERNIN, FRANCE
Covered Property
(1)
Method of Bonding Two Substrates
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 12, 2010
From: KERDILES, SEBASTIEN; MICHEL, WILLY; SCHWARZCNHACH, WALTER; DELPRAT, DANIEL
To: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
Reel/Frame 023764/0592 →
Change of Name
Mar 4, 2012
From: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
To: SOITEC
Reel/Frame 027800/0911 →