Patent Assignment
Reel/Frame 024849/0912
Assignment of Assignor's Interest
Recorded: 2010-08-17
Pages: 4
Assignors
ISHIZUKA, TOHRU
Executed: 2010-07-09
NOTO, NOBUHIKO
Executed: 2010-07-09
KOBAYASHI, NORIHIRO
Executed: 2010-07-09
NAKANO, MASATAKE
Executed: 2010-07-08
Assignee
SHIN-ETSU HANDOTAI CO., LTD.
6-2, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Soi Wafer, Semiconductor Device, and Method for Manufacturing Soi Wafer