Patent Assignment
Reel/Frame 024865/0334
Assignment of Assignor's Interest
Recorded: 2010-08-20
Pages: 3
Assignor
JEONG, YONGKUK
Executed: 2010-03-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Cmos Transistors Using Tensile Stress Layers and Hydrogen Plasma Treatment
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 20, 2010
From: KANG, LAEGU
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 024865/0382 →
Assignment of Assignor's Interest
Aug 20, 2010
From: SUNG, KIM NAM
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 024865/0514 →
Assignment of Assignor's Interest
Aug 20, 2010
From: YANG, DAE-WON
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 024865/0542 →
Merger
Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040652 Frame: 0241. Assignor(S) Hereby Confirms the Merger and Change of Name.
Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
Security Agreement
Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest
Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →