Patent Assignment
Reel/Frame 024984/0851
Assignment of Assignor's Interest
Recorded: 2010-09-14
Pages: 6
Assignors
MOHAMED, NADIA BEN
Executed: 2010-08-13
CHUANG, TA KO
Executed: 2010-09-10
CITES, JEFFREY SCOTT
Executed: 2010-09-10
DELPRAT, DANIEL
Executed: 2010-08-16
USENKO, ALEX
Executed: 2010-09-10
Assignees
CORNING INCORPORATED
INTELLECTUAL PROPERTY DEPARTMENT, SP-TI-03-1, CORNING, NEW YORK, 14831
S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES
38190, BERNIN, FRANCE
Covered Property
(1)
Semiconductor on Glass Substrate with Stiffening Layer and Process of Making the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.